Delidding is a process with the goal of reducing CPU core temperatures on processors with less ideal thermal interfaces between silicon and headspreader. The benefits of delusing designs with such interfaces lead to having a cooling system, or the ability to do extra overclocking with a larger delta for thermal headroom. However, removing the processor does carry a risk, such as potentially damaging the CPU when done wrongly and certainly void the warranty. In this article, we have produced a How-To guide to remove one of the latest desktop processors: AMD's Ryzen 5 2400G APU.
What is Delidding?
Most modern processors are manufactured with an integrated heat spreader (IHS) at the top of the package, and attached to packets with glue layers. Between the CPU and headspreader is the thermal interface material (TIM). TEAM is designed to move heat from the processor to the headspreader and eventually become the CPU cooler. The quality of TIM used on modern processors can vary greatly, from cheap thermal paste layers to direct indium tin solder between dead silicon and IHS.
When manufacturers decide how to package their processor, the type of TIM used is an important part of the decision. Not only should it be enough to last for the last 10 years, it should also ensure that the processor works in specification for that time, after many cycles of heat. This method should also be improved - some processor families are produced on a tens of millions scale, so the process should be fast. This should also be the right cost per unit. Saving one cent per unit of more than ten million units is a saving of $ 100k.
Much of the discussion on the internet on this topic revolves around why cheaper implementations do not spend $ 0.10 more for better solutions, especially on a $ 1999 product (or why a superior product has a cheap implementation). In the end a good balance must be made - a standard 'goop / paste' TEAM has sufficient longevity but lower performance, while direct soldering performs best but may not last for years mulitple cycles.
By removing the processor, the user can replace the TIM between die and IHS. Usually this is done to remove a cheap goopy paste solution and put a better interface, ultimately improving to a higher performance variant, or what some people might argue should be standard. Removing the processor because it works best on solutions that have the cheapest TIM implementations.
For our guide here, we have chosen to remove one of our Ryzen 2000 APU series. While the AMD Ryzen 2000 series APU has been proven to be a budget-friendly light game worker, extreme overclockers and Roman engineer Der8auer Hartung have created and marketed a special add-on kit / delusing tool for use in the removal of the Ryzen 2000 APU series. This is called Delid Mate 2, which we will use today.
The conceptual idea of delidding is primarily associated with an unsold CPU, which historically is the way Intel builds its processor. Almost all modern Intel mainstream CPUs. such as the Intel Core i7-4770K, i7-6700K and even the latest i7-8700K uses thick goopy paste to make contact between CPU and IHS. For AMD's lineup, the APU processor uses a similar method - so the new APU Ryzen 2000 series and Bristol Ridge APU.
It should be noted that all AMDs that use desktop-based chips like Ryzen and Threadripper all use indium tin solder, and do not need to be laughed at. Similarly, Intel HEDT processors are often not ignored.
The idea is that replacing inexpensive and inexpensive pre-applied pastes with a thinner layer of better quality pastes or higher performance liquid metals (measured in W / mK, Watts per Kelvin-meter) not only increases the thermal conductivity and thermal heat transfer from die, to IHS, to cooling plate, but may also allow a quieter system because the fan does not have to work hard.
What are the Benefits?
The 2000 Ryzen series of APUs is a great product for the price, and there are several important reasons why removing one can be useful. The largest applications where thermal is more important are in narrow space like in small form factor PCs or in home theater PCs that specialize in small form factors and quiet systems. In HTPC, delidding will reduce the pressure on small coolers in play, as well as reduce noise from fans.
Another application in delidding is extracting every last drop of headroom available from it, whether it runs a Ryzen APU capable of bypassing its non-delusing ability to increase the in-game image frequency, or even shave time in creating video projects; benefits apply to most scenarios with higher clock speeds.
In our results, shown on the last page, we see a 12ºC drop in temperature when the system is fully loaded on stock frequency, and a reduction of 11ºC when overclocked to 4.1 GHz. Due to the nature of the manufacturing process, we manage other +100 MHz on overclock as well.
What are the Biggest Risks Involved?
First of all, the greatest risk in removing the processor is damaging the processor during the process. The last thing any user wants is to destroy their new chips with an obscure slip on the wrist. The older method of delusing processors involved using hammers and vice, potentially causing the CPU to fly and crash into the wall when too much power is applied (yes, I have done this personally).
Another equally large risk in removing the processor is instantly void the warranty, which removes the inherent right of the consumer to return if it is wrong, or if it somehow dies in the process. This alone gives the greatest consequence of deletion and should not be done on any non-replaceable component; RMA fraud is unforgivable and will not get any further mention besides this one.
What tools do I need to safely protect my Ryzen 2000 Series APU?
There are many methods used to remove and remove IHS from packets. Market in such a way that there are now tools made specifically for the process, such as Der8auer Delid Die Mate 2, or 3D printing tools, including those created by users with the name Chri. Other and very risky methods are hammer and vice and cutting methods that involve separating the glue from a heat spreader. The risk involved with this means a small calculation error with the pressure and cutting depth can be 'nickname' die which will make silicon potentially useless and dead.
My method to remove Ryzen 5 2400G ($ 169) is to use Der8auer Delid Die Mate 2 which sells for about $ 48 on Amazon. While other methods seem rather interesting and ultimately cheaper, the cost of silicon dies outweighs the cost of the associated tool. I have used various Der8auer tools for years including the first Delid Die Mate and Delid Die Mate X for X299 chips.
While the above tools are specifically manufactured with the intention of removing Intel-based Kaby Lake, Coffee Lake and even older Sky Lake processors, an additional AMD kit is available. This package consists of a longer six-sixth diameter threaded bolt M6 x 60 mm and acrylic adapter to ensure the bolt does not touch the pin. Based on AMD using a pin-grid array socket on the processor (ie the pin at the bottom), it makes the process all the more riskier.
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